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Analysis of Lead and Cadmium in Electroless Nickel Plating Solution (Flame method)

Heavy metals including Lead (Pb) and Cadmium (Cd) were traditionally used as the stabilizer in plating solutions, However, with the enforcement of regulations such as RoHS, most plating solutions are currently lead-free or heavy metal-free and Pb, Cd etc. are controlled as impurities.

In the analysis of impurities such as Pb and Cd in nickel plating solution, the absorption line of the main component contained in high concentration (nickel) cause spectral interference when the deuterium lamp correction method is used. Therefore, the correction for the measured value is known to be difficult.

By using ZA3000 with the polarized Zeeman correction method, accurate quantitative analysis is possible as the background correction can be performed without being affected by the absorption line of nickel, the main component.


Similar case in analysis of Cadmium in electroless Nickel Plating Solution(Flame Method)

Hitachi ZA 3000


For more information on Hitachi AAS, please visit Hitachi High-Tech Science website



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